Bond graph modeling and simulation of mechatronic systems

M. A. Malik; A. Khurshid

doi:10.1109/INMIC.2003.1416738

Bond graph modeling and simulation of mechatronic systems

M. A. Malik, A. Khurshid

Mechanical and Industrial Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

20 Citations (Scopus)

Abstract

The traditional modeling and simulation techniques for dynamic systems are generally adequate for single-domain systems only. Mechatronic systems, being a mix of mechanical and electronic systems, deal with multi-domain systems. Such systems may typically include translational, rotational, thermofluid, electrical, electromechanical and electronic systems. Modeling and simulation of such multi-domain systems pose formidable new challenges and, hence, demand new strategies and techniques for reliable solutions. The bond graph method (BGM) is rapidly emerging to offer a new modeling and simulation methodology that is ideally suited to effectively unify knowledge pertaining to multi-domain systems for mechatronic applications. The BGM combined with genetic programming (GP) offers tremendous opportunities in artificial intelligence, image processing, and robotic and industrial automation, The extension of BGM for applications to fields such as social behavior, economics and operational research is a very active topic of current research. This work illustrates the methodology offered by BGM for modeling and simulation of mechatronic systems.

Original language	English
Title of host publication	Proceedings - INMIC 2003: IEEE 7th International Multi Topic Conference
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	309-314
Number of pages	6
ISBN (Print)	0780381831, 9780780381834
DOIs	https://doi.org/10.1109/INMIC.2003.1416738
Publication status	Published - 2003
Event	7th IEEE International Multi Topic Conference, INMIC 2003 - Islamabad, Pakistan Duration: Dec 8 2003 → Dec 9 2003

Other

Other	7th IEEE International Multi Topic Conference, INMIC 2003
Country/Territory	Pakistan
City	Islamabad
Period	12/8/03 → 12/9/03

Keywords

Bonding
Circuits
Computational modeling
Decision making
Flow graphs
Genetics
Humans
Mechatronics
Predictive models
Robotics and automation

ASJC Scopus subject areas

Computer Networks and Communications
Computer Science Applications
Hardware and Architecture
Signal Processing
Modelling and Simulation

Access to Document

10.1109/INMIC.2003.1416738

Cite this

Malik, MA & Khurshid, A 2003, Bond graph modeling and simulation of mechatronic systems. in Proceedings - INMIC 2003: IEEE 7th International Multi Topic Conference., 1416738, Institute of Electrical and Electronics Engineers Inc., pp. 309-314, 7th IEEE International Multi Topic Conference, INMIC 2003, Islamabad, Pakistan, 12/8/03. https://doi.org/10.1109/INMIC.2003.1416738

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abstract = "The traditional modeling and simulation techniques for dynamic systems are generally adequate for single-domain systems only. Mechatronic systems, being a mix of mechanical and electronic systems, deal with multi-domain systems. Such systems may typically include translational, rotational, thermofluid, electrical, electromechanical and electronic systems. Modeling and simulation of such multi-domain systems pose formidable new challenges and, hence, demand new strategies and techniques for reliable solutions. The bond graph method (BGM) is rapidly emerging to offer a new modeling and simulation methodology that is ideally suited to effectively unify knowledge pertaining to multi-domain systems for mechatronic applications. The BGM combined with genetic programming (GP) offers tremendous opportunities in artificial intelligence, image processing, and robotic and industrial automation, The extension of BGM for applications to fields such as social behavior, economics and operational research is a very active topic of current research. This work illustrates the methodology offered by BGM for modeling and simulation of mechatronic systems.",

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AU - Khurshid, A.

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AB - The traditional modeling and simulation techniques for dynamic systems are generally adequate for single-domain systems only. Mechatronic systems, being a mix of mechanical and electronic systems, deal with multi-domain systems. Such systems may typically include translational, rotational, thermofluid, electrical, electromechanical and electronic systems. Modeling and simulation of such multi-domain systems pose formidable new challenges and, hence, demand new strategies and techniques for reliable solutions. The bond graph method (BGM) is rapidly emerging to offer a new modeling and simulation methodology that is ideally suited to effectively unify knowledge pertaining to multi-domain systems for mechatronic applications. The BGM combined with genetic programming (GP) offers tremendous opportunities in artificial intelligence, image processing, and robotic and industrial automation, The extension of BGM for applications to fields such as social behavior, economics and operational research is a very active topic of current research. This work illustrates the methodology offered by BGM for modeling and simulation of mechatronic systems.

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KW - Circuits

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KW - Humans

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KW - Predictive models

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ER -

Bond graph modeling and simulation of mechatronic systems

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Keywords

ASJC Scopus subject areas

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