Shape optimization of micro-channel heat sink for micro-electronic cooling

Afzal Husain*, Kwang Yong Kim

*المؤلف المقابل لهذا العمل

نتاج البحث: المساهمة في مجلةArticleمراجعة النظراء

102 اقتباسات (Scopus)


Abstract-A numerical investigation of 3-D fluid flow and heat transfer in a rectangular micro-channel has been carried out using water as a cooling fluid in a silicon substrate. Navier-Stokes and energy equations for laminar flow and conjugate heat transfer are solved using a finite volume solver. Solutions are first carefully validated with available analytical and experimental results; the shape of the micro-channel is then optimized using surrogate methods. Ratios of the width of the micro-channel to the depth and the width of the fin to the depth are selected as design variables. Design points are selected through a four-level full factorial design. A single objective function thermal resistance, formulated using pumping power as a constraint, is optimized. Mass flow rate is adjusted by the constant pumping power constraint. Response surface approximation, Kriging, and radial basis neural network methods are applied to construct surrogates and the optimum point is searched by sequential quadratic programming.

اللغة الأصليةEnglish
الصفحات (من إلى)322-330
عدد الصفحات9
دوريةIEEE Transactions on Components and Packaging Technologies
مستوى الصوت31
رقم الإصدار2 SPEC. ISS.
المعرِّفات الرقمية للأشياء
حالة النشرPublished - 2008
منشور خارجيًانعم

ASJC Scopus subject areas

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