TY - JOUR
T1 - Computational Analysis of Liquid Jet Impingement Microchannel Cooling
AU - Zunaid, M.
AU - Cho, Haeng Muk
AU - Husain, Afzal
AU - Jindal, Anant
AU - Kumar, Rohit
AU - Chauhan, Bhupendra Singh
N1 - Publisher Copyright:
© 2018 Elsevier Ltd.
PY - 2018
Y1 - 2018
N2 - This study evaluated a micro-jet impingement heat sink for the cooling of electronic field at micro level devices. In the present study, a three-dimensional fluid flow and heat transfer analysis was carried out numerically for different fluids and various heat sink materials. Six different materials as copper, aluminum, steel, silicon, titanium and nickel were analyzed to be used as substrate of the micro-channel heat sink. Water, DIUF water (De-Ionized Ultra-Filtered), Performance fluid-5052, and HF-7100 were used as working fluids. For the micro channel heat sink investigated and obtained that the temperature distribution along the flow direction in the solid and fluid regions have linear behavior. Heat transfer coefficient and temperature distribution was obtained for various cases and the results have been interpreted. It was observed that copper based material has the highest value of heat transfer coefficient as compared to remaining five materials analyzed. Copper and working fluid DIUF water together have the highest heat transfer coefficient.
AB - This study evaluated a micro-jet impingement heat sink for the cooling of electronic field at micro level devices. In the present study, a three-dimensional fluid flow and heat transfer analysis was carried out numerically for different fluids and various heat sink materials. Six different materials as copper, aluminum, steel, silicon, titanium and nickel were analyzed to be used as substrate of the micro-channel heat sink. Water, DIUF water (De-Ionized Ultra-Filtered), Performance fluid-5052, and HF-7100 were used as working fluids. For the micro channel heat sink investigated and obtained that the temperature distribution along the flow direction in the solid and fluid regions have linear behavior. Heat transfer coefficient and temperature distribution was obtained for various cases and the results have been interpreted. It was observed that copper based material has the highest value of heat transfer coefficient as compared to remaining five materials analyzed. Copper and working fluid DIUF water together have the highest heat transfer coefficient.
KW - CFD
KW - cooling
KW - heat transfer
KW - impingement
KW - microchannel
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U2 - 10.1016/j.matpr.2018.10.026
DO - 10.1016/j.matpr.2018.10.026
M3 - Conference article
AN - SCOPUS:85061203559
SN - 2214-7853
VL - 5
SP - 27877
EP - 27883
JO - Materials Today: Proceedings
JF - Materials Today: Proceedings
IS - 14
T2 - 2018 International Conference on Composite Materials: Manufacturing, Experimental Techniques, Modeling and Simulation, ICCMMEMS 2018
Y2 - 1 March 2018 through 3 March 2018
ER -